Company
Subsidiaries & Affiliates
Heat-dissipation substrate business and the Digital Solution overseas entity.
Affiliate
Heat-Dissipation Substrate Business
TPC Ceramic Substrates
Heat-dissipation substrates for power semiconductors, with Cu patterns printed on ceramic.
Thermal cycle durability 4.6x that of Al₂O₃ and 9x that of AlN.
Contact
How can we help?
Send us your product, technology, or partnership inquiry and our team will review it and reply.
Contact Us
031-376-5400 Weekdays 09:00~18:00